Method for forming LED by a substrate removal process

Details Method for forming LED by a substrate removal process Method for forming LED by a substrate removal process

2006-04-11

2006-04-11

Sarkar, Asok Kumar (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

Reexamination Certificate

active

07026181

ABSTRACT:
The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.

REFERENCES:
patent: 4218270 (1980-08-01), Hasegawa et al.
patent: 5403916 (1995-04-01), Watanabe et al.
patent: 5453405 (1995-09-01), Fan et al.
patent: 5798537 (1998-08-01), Nitta
patent: 6657238 (2003-12-01), Ueda
patent: 6818531 (2004-11-01), Yoo et al.
patent: 6831302 (2004-12-01), Erchak et al.
patent: 2003/0189212 (2003-10-01), Yoo
patent: 2003/0189215 (2003-10-01), Lee et al.

Affiliated with

Also associated with

Rating

Method for forming LED by a substrate removal process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming LED by a substrate removal process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming LED by a substrate removal process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3564990