Method for forming LED by a substrate removal process

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

Reexamination Certificate

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Details

C438S114000, C438S458000, C438S460000, C438S464000, C438S956000

Reexamination Certificate

active

06969626

ABSTRACT:
The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.

REFERENCES:
patent: 4218270 (1980-08-01), Hasegawa et al.
patent: 5403916 (1995-04-01), Watanabe et al.
patent: 5453405 (1995-09-01), Fan et al.
patent: 5798537 (1998-08-01), Nitta
patent: 6657238 (2003-12-01), Ueda
patent: 6818531 (2004-11-01), Yoo et al.
patent: 6831302 (2004-12-01), Erchak et al.

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