Method for forming isolation region in semiconductor device usin

Fishing – trapping – and vermin destroying

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437228, 437245, 437160, H01L 2176

Patent

active

052565912

ABSTRACT:
A method for forming an isolation region in a semiconductor device using a trench comprising the steps of forming a reaction restraining layer on a semiconductor substrate, removing a portion of the reaction restraining layer corresponding to a trench region for providing an isolation region, forming a reaction film on the entire exposed surface, heat treating the reaction film and the substrate, to form a reaction product film having a predetermined depth in a portion of the reaction film and a portion of the substrate corresponding to said trench region, etching and removing the reaction product film, to form a trench, forming an insulation film for the isolation region such that it fills sufficiently the trench, forming a surface smoothing insulation film on the insulation film for the isolation region, etching back both the insulation films such that their portions located above a predetermined height from the surface of the substrate are removed, and removing the remaining reaction restraining layer.

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