Method for forming intermetallic layers in thin films for improv

Details Method for forming intermetallic layers in thin films for improv Method for forming intermetallic layers in thin films for improv

1977-02-04

1979-05-15

Smith, Ronald H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427124, 427127, 427131, 427250, 427272, 427294, 427376G, 427404, 29578, 29625, B05D 512

Patent

active

041548744

ABSTRACT:
A method for forming narrow intermetallic stripes which will carry high currents on bodies such as semiconductors, integrated circuits, magnetic bubbles structures, etc. The conductive stripe includes aluminum or aluminum copper with at least one transition metal. The aluminum and at least one transition metal are deposited onto a supporting body at a very low pressure in a substantially oxygen-free high vacuum. The composite is then annealed at a temperature between about 200.degree. C. and 525.degree. C. for a time sufficient to form an aluminum and transition metal compound within the aluminum. The conductive stripes are then formed by masking and removing portions of the annealed metallic material. The resulting conductive stripes, which may be of a width of about 6.times.10.sup.-4 inches or less, have a significantly improved electromigration performance without significantly increasing resistance in the conductive stripe.

REFERENCES:
patent: 3343254 (1967-09-01), Velde et al.
patent: 3725309 (1973-04-01), Ames et al.
patent: 3743894 (1973-07-01), Hall et al.
patent: 3830657 (1974-08-01), Farrar
patent: 3858304 (1975-01-01), Leedy et al.
patent: 4035526 (1977-07-01), Konantz et al.
patent: 4042954 (1977-08-01), Harris

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