Method for forming interconnections between channels and...

Details Method for forming interconnections between channels and... Method for forming interconnections between channels and...

2006-05-02

2006-05-02

Sells, James (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S250000

Reexamination Certificate

active

07037400

ABSTRACT:
A method of forming interconnections between channels and/or chambers for use in a micro-fluidic device. Two planer substrates (usually glass and silicon respectively) having etched channels are bonded together to form volmes where the channels overlap. A manifolding cut is then made through the glass, intersecting glass channels only. An organic solution is passed into cut, and flows through silicon channels. An aqueous solution is passed into cut, and flows through glass channels. The solutions meet in the region, where matter is transferred from one solution to another.

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International Search Report for corresponding PCT application No. PCT/GB99/00018.

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