Method for forming individual letters provided with envelopes

Details Method for forming individual letters provided with envelopes Method for forming individual letters provided with envelopes

2008-05-19

2010-06-22

Truong, Thanh K (Department: 3721)

Package making

Methods

Forming a cover adjunct or application of a cover adjunct to...

C053S429000, C053S435000, C053S460000, C270S052020

Reexamination Certificate

active

07739858

ABSTRACT:
A method for forming individual letters provided with envelopes from printed same-size sheets, includes pre-printed envelope forms for forming the envelopes, and in the immediate vicinity of each envelope form one or more letter forms for forming a letter or letters and inserting them in the envelope. The envelope form is led as such to envelope formation; the letter forms are cut at least on one side into letters which are smaller than the letter forms; the letters are brought to contact with the envelope form; the envelope form is folded in two around the letters and glued at the side edges to form an open envelope; and the open flap of the envelope is glued and folded so that a sealed letter provided with an envelope is formed.

REFERENCES:
patent: 3902655 (1975-09-01), Huffman
patent: 4012268 (1977-03-01), Johnsen
patent: 4189895 (1980-02-01), Volkert et al.
patent: 4343129 (1982-08-01), Gunther et al.
patent: 4464878 (1984-08-01), Golicz et al.
patent: 4543082 (1985-09-01), Stenner
patent: 4600141 (1986-07-01), Bradley et al.
patent: 4787192 (1988-11-01), Gunther, Jr.
patent: 4900391 (1990-02-01), Mandel et al.
patent: 5398867 (1995-03-01), Murphy
patent: 6073421 (2000-06-01), Lee
patent: 6266944 (2001-07-01), Consiglio
patent: 6865864 (2005-03-01), Katz
patent: 7090114 (2006-08-01), Katz
patent: 2003/0222127 (2003-12-01), Katz
patent: 2006/0136490 (2006-06-01), Aggarwal et al.
patent: 0 297 843 (1989-01-01), None
patent: 0 447 183 (1991-09-01), None
patent: 0 780 243 (1997-06-01), None
patent: 1 693 185 (2006-08-01), None
patent: WO 2004/089646 (2004-10-01), None
patent: 2007/012740 (2007-02-01), None

Affiliated with

Also associated with

Rating

Method for forming individual letters provided with envelopes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming individual letters provided with envelopes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming individual letters provided with envelopes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4248455