Method for forming hermetic seals

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

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Details

228209, 228208, 427229, B23K 120, B05D 302

Patent

active

046501088

ABSTRACT:
A firmly adherent film 16 of bondable metal, such as silver, is applied to the surface 10 of glass or other substrate by decomposing a layer 14 of a solution of a thermally decomposable metallo-organic deposition (MOD) compound such as silver neodecanoate in xylene. The MOD compound thermally decomposes into metal and gaseous by-products. Sealing is accomplished by depositing a layer 18 of bonding metal, such as solder or a brazing alloy, on the metal film and then forming an assembly with another high melting point metal surface 20 such as a layer of Kovar. When the assembly is heated above the temperature of the solder, the solder flows, wets the adjacent surfaces and forms a hermetic seal between the metal film 14 and metal surface 20 when the assembly cools.

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patent: 4188417 (1980-02-01), Lichtenberg
patent: 4262040 (1981-04-01), Russo
patent: 4333966 (1982-06-01), Deffeyes et al.
patent: 4399090 (1983-08-01), Sprangers et al.
patent: 4418099 (1983-11-01), Cuevos et al.
patent: 4459264 (1984-07-01), Mizuhara

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