Method for forming flat surface vias in integrated circuit subst

Details Method for forming flat surface vias in integrated circuit subst Method for forming flat surface vias in integrated circuit subst

1998-04-01

2000-04-04

Utech, Benjamin L.

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 18, H01B 1300

Patent

active

060457147

ABSTRACT:
Conductive vias in integrated circuit ceramic greensheets are formed with essentially flat exposed surfaces by applying an adherent in situ mask material to the greensheet prior to punching via openings therethrough. The in situ mask material then serves to permit the application of a second overprint conductive paste after the original conductive paste has filled the via opening and formed a depression upon hardening. The second overprint paste fills the depression and leaves an essentially flat top surface. When the in-situ mask material is removed, a slight protuberance of conductive paste remains in a plane vacated by the in-situ mask material (with or without the second conductive paste application). In one form of the invention, this protuberance is compressed back so that it is essentially level with the surrounding ceramic greensheet by the application of pressure thereto, either by a platen or by an adjoining greensheet lamina.

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