Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2004-05-13
2010-10-26
Barr, Michael (Department: 1711)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S372200, C427S383100, C427S404000
Reexamination Certificate
active
07820232
ABSTRACT:
The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 μm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C. or lower under an atmosphere containing a vapor and a gas of a compound having reducibility to reduce the oxide film by a reduction reaction which used the compound having reducibility as a reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and sintering the resultant copper fine particles with each other to form a layer of the sintered product.
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European Search Report dated Jul. 24, 2009.
Hata Noriaki
Itoh Daisuke
Izumitani Akihito
Matsuba Yorishige
Barr Michael
Harima Chemicals Inc.
Knobbe Martens Olson & Bear LLP
Schiro Ryan
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