Method for forming film of uniform thickness on semiconductor su

Details Method for forming film of uniform thickness on semiconductor su Method for forming film of uniform thickness on semiconductor su

1989-01-17

1992-08-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 67, 437229, 437231, H01L 21465

Patent

active

051358913

ABSTRACT:
A photoresist of sufficient thickness to fill a scribe line is applied on an entire substrate. Then, the photoresist is exposed through a photomask having a pattern corresponding to the scribe line and is thereafter developed. A photosensitized gelatin is applied by spin-coating on the flat substrate obtained in this process, patterned, and then dyed, to obtain a color filter array.

REFERENCES:
patent: 4088490 (1978-05-01), Duke et al.
patent: 4665010 (1987-05-01), Herd et al.
Wolf and Tauber, "Silicon Processing for the VLSI era-vol. 1-Process Technology", Lattice Press, Sunset Beach, Calif.
Stillwagon et al., "Fundamentals of Topographic Substrate Levelling", J. Appl. Phys. 63(11), Jun. 1, 1988, pp. 5251-5258.
Wilson et al., "Effect of Circuit Structure on Planarization Resist Thickness," J. Electrochem. Soc., May 1986, pp. 981-984.
Crapella et al., "Planarization by Two-Resist Level," J. Electrochem. Soc., Mar. 1988, pp. 683-685.
Gokan et al., "Uniform Polymer Coating Technique for an Etch-Back Planarization Process Using Low Molecular Weight Polymers," J. Electrochem. Soc., Apr. 1988, pp. 10-19-1021.
Stillwagon et al., "Planarization of Substrate Topography by Spin Coating," J. Electrochem. Soc., Aug. 1987, pp. 2030-2037.
L. K. White, "Planarization Properties of Resist and Polyimide Coatings," J. Electrochem. Soc., Jul. 1983, pp. 1543-1548.
Ikeno et al., "Effects of Superficial Topography on Uniformity of Spun-On Resist Film," Extended Abstracts, vol. 88-2, The Electro-Chemical Society, Fall Meeting, Chicago, Ill., Oct. 9-14, 1988, pp. 1041-1042.

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