Method for forming features upon a substrate

Coating processes – Electrical product produced – Metal coating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427282, 427405, 22818022, 228 563, B05D 512

Patent

active

060512733

ABSTRACT:
A material deposition process is disclosed in which apertures of a contact mask used therein have a constricted opening terminating in a `knife edge` in a sidewall thereof near the top mask side, especially within the top 25% of the mask thickness above the substrate. A process is disclosed in which the mask, in addition, has apertures which have larger dimension lower openings on a bottom side of the mask contacting the substrate than constricted openings near the top side of the mask. Single solder bump and "bump on bump" over BLM (ball limiting metallurgy) processes are disclosed which utilize such contact mask to reduce the damage and detaching of such features during processing and subsequent handling.

REFERENCES:
patent: 3512051 (1970-05-01), Noll
patent: 4830723 (1989-05-01), Galvagni et al.
patent: 5359928 (1994-11-01), Blessington, et al.
patent: 5634268 (1997-06-01), Dalal et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming features upon a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming features upon a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming features upon a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2334658

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.