Method for forming elongated solder connections between a semico

Details Method for forming elongated solder connections between a semico Method for forming elongated solder connections between a semico

1983-11-25

1985-10-08

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 29576R, 29576J, 29591, 357 65, 357 68, 174 685, 339 17B, H01L 2144

Patent

active

045456100

ABSTRACT:
A process for forming elongated solder terminals to connect a plurality of pads on a semiconductor device to a corresponding plurality of pads on a supporting substrate by,

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Sideris, "Bumps and Balls, Pillars and Beams: A Survey of Face Bonding Methods", Electronics, Jun. 28, 1965, pp. 68-73.
IBM TDB, vol. 16, No. 3, Aug. 1973, p. 767.
IBM TDB, vol. 19, No. 4, Sep. 1976, p. 1178.
IBM TDB, vol. 23, No. 2, Jul. 1980, p. 575.
IBM TDB, vol. 17, No. 2, Jul. 1974, p. 627.

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