Method for forming electrode for electrical connections to oxide

Details Method for forming electrode for electrical connections to oxide Method for forming electrode for electrical connections to oxide

1992-01-28

1993-08-31

King, Roy

Superconductor technology: apparatus, material, process

High temperature , per se

Having tc greater than or equal to 150 k

505701, 505706, 427 62, 427125, 427404, 427405, 427250, 156643, 156656, B05D 512, H01L 3912

Patent

active

052409058

ABSTRACT:
A metal electrode formed on an oxide superconductor for electric connection to the oxide superconductor, includes a first layer of Ag in direct contact with the oxide superconductor, and a second layer formed on the first layer. The second layer is formed of noble metal excluding Ag. The metal electrode can be formed by forming a first layer of Ag to cover a whole surface of the oxide superconductor layer, and forming a second layer of noble metal excluding Ag, to cover a whole surface of the first layer, thereby to form a double metal layer, and patterning the double metal layer so as to form a metal electrode composed of the double metal layer.

REFERENCES:
Sugimoto et al., "Low Resistance Ohmic Contact for the Oxide Superconductor EuBa.sub.2 Cu.sub.3 O.sub.y ", Jpn. J. Appl. Phys. 27(5) May 1988 pp. L864-L866.
Ma et al., "Characterization of Bilayer-Metal Contacts to High Tc Superconducting Films," J. Vac. Sci. Technol. A9(3), May/Jun. 1991 pp. 390-393.
Y. Iye et al., "A simple method for attaching electrical leads to small samples of high-Tc oxides", Japanese Journal of Applied Physics, vol. 27, No. 4, Apr. 1988, pp. 658-660, Tokyo, JP.
Y. Tazoh et al., "Low resistance ohmic contacts to high-Tc superconducting thin films", IEEE Transactions on Magnetics, vol. 25, No. 2, Aug. 1989, pp. 2049-2052, New York, US.
P. Y. Hsieh et al., "Electrical conductivity and buffer-layer studies of high Tc superconductors by C-V measurements", Proceedings of the 2nd Annual Conference on Superconductivity and its Applications, 18th Apr. 1988, pp. 214-222, Buffalo, US.

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