Method for forming electrical interconnections in laminated vias

Details Method for forming electrical interconnections in laminated vias Method for forming electrical interconnections in laminated vias

1992-12-10

1994-05-31

Green, Anthony

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427 96, 427 98, 427123, 427124, 427555, 29885, 20415715, 361794, B05D 306, B05D 512

Patent

active

053168038

ABSTRACT:
A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines contained within each substrate to melt and form a fused mass protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.

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