Method for forming electrical contact to the optical coating of

Details Method for forming electrical contact to the optical coating of Method for forming electrical contact to the optical coating of

1995-06-07

1997-03-04

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257437, 257444, 257448, 257459, 250332, 2503384, H01L 310232

Patent

active

056082541

ABSTRACT:
This is a system and method of forming an electrical contact to the optical coating of an infrared detector using conductive epoxy. The method may comprise: forming thermal isolation trenches 22 and bias contact vias 23 in a substrate 20; depositing a trench filler 24 in the thermal isolation trenches 22; depositing conductive epoxy 50 into the bias contact vias 23; replanarizing; depositing a common electrode layer 31 over the thermal isolation trenches 22 and vias 23; depositing an optical coating 26 above the common electrode layer 31; mechanically polishing a backside of the substrate 20 to expose the trench filler 24 and conductive epoxy 50; depositing a contact metal 34 on the backside of the substrate 20; etching the contact metal 34 and the trench filler 24 to form pixel mesas of the contact metal 34 and the substrate 20.

REFERENCES:
patent: 4740700 (1988-04-01), Shaham et al.
patent: 5047644 (1991-09-01), Meissner et al.
patent: 5426304 (1995-06-01), Belcher et al.
patent: 5485010 (1996-01-01), Owen et al.

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