Method for forming electrical components comprising cured vinyl

Details Method for forming electrical components comprising cured vinyl Method for forming electrical components comprising cured vinyl

1984-12-21

1987-10-13

Bueker, Richard

Fishing, trapping, and vermin destroying

427 96, 427337, 4273855, B05D 512

Patent

active

046998039

ABSTRACT:
Electronic components are disclosed comprising an insulator which is the in situ cured reaction product of a polymerizable oligomer which is end capped with vinyl or acetylenic end groups. The polymerizable oligomer comprises polyamic acids, the corresponding polyamic esters, the corresponding polyisoimides and mixtures thereof. A process for forming the electronic components comprising the insulator is also disclosed.

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Mukai et al, "Planar Multilevel Interconnection Technology Employing a Polyimide", IEE Journal of Solid-State Circuits, vol. 13, No. 4, Aug. 1978, pp. 462-467.

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