Method for forming dielectrically isolated semiconductor devices

Fishing – trapping – and vermin destroying

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437 33, 437 90, H01L 2176

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active

050495216

ABSTRACT:
A method for forming a dielectrically isolated semiconductor devices on a semiconductor substrate. An epitaxial layer is grown on a wafer having a thin buried oxide layer. Trench regions are etched through the epitaxial layer to the underlying oxide layer. A dielectric isolation layer is formed on the sidewalls of the trench regions so as to isolate an active region of the epitaxial semiconductor material. The trenches are etched to the underlying semiconductor substrate and the semiconductor material is selectively epitaxially regrown in the trench regions. Semiconductor devices are formed in the isolated active regions. Contacts are made to the active regions of the semiconductor device and to the wafer substrate through the epitaxially regrown trench regions.

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