Coating processes – Direct application of electrical – magnetic – wave – or... – Chemical vapor deposition
Patent
1994-08-08
1995-09-19
Dang, Thi
Coating processes
Direct application of electrical, magnetic, wave, or...
Chemical vapor deposition
4272481, 427256, B05D 500
Patent
active
054514355
ABSTRACT:
A method of forming a planarized or smoothed dielectric or other material layer upon a partially fabricated intergrated circuit is disclosed. Conventional planarization techniques involve deposition of a dielectric or other material layer followed by anisotropic etchback. Unfortunately, some commercial equipment tends to etch the center of the wafer faster than the edges. The disclosed process forms a layer which is thicker in the central region than the edge region. Thus, when the disclosed process is followed by a conventional etchback, a planar dielectric or other material layer over the entire wafer is formed. Other aspects of the invention include processes and apparatus for producing smooth deposition and etching by control of the impedance of the etching and/or chemical precursor gases.
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AT&T Corp.
Dang Thi
Rehberg John T.
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