Method for forming deposited film

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 41, 427 531, 427 541, 427 55, B05D 306

Patent

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046456848

ABSTRACT:
A method for forming a deposited film comprises forming in a vacuum chamber housing a substrate therein a deposited film containing silicon on the substrate by subjecting a gas represented by the general formula: ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4, can be the same or different and are each independently hydrogen or a hydrocarbon group, to polymerization.

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