Fishing – trapping – and vermin destroying
Patent
1994-04-11
1995-08-29
Fourson, George
Fishing, trapping, and vermin destroying
22818022, H01L 2128
Patent
active
054459940
ABSTRACT:
A method for forming custom planar connections to the bonding pads of a semiconductor die is provided. The method includes the steps of: depositing a passivation layer on the bonding pads; forming a patterning layer by depositing a dielectric material such as TEOS on the passivation layer; etching through the patterning layer and passivation layer to the bond pads using a first etch mask; etching a connector pattern in the patterning layer using a second etch mask; depositing a metal layer over the patterning layer; and then planarizing the metal layer to an endpoint of the patterning layer to form planar metal connectors having a desired thickness.
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Everhart C.
Fourson George
Gratton Stephen A.
Micro)n Technology, Inc.
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