Method for forming cover layer over wire joint

Details Method for forming cover layer over wire joint Method for forming cover layer over wire joint

1987-11-30

1989-04-18

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Making electrical conductors of indefinite length

156 49, 156 55, 156 56, 1562755, 264 22, 26427214, H01B 1306, H01B 1308

Patent

active

048224340

ABSTRACT:
The invention provides an improved method for forming a cover layer over a joint of electrical wires. Portions of insulation layers of wires to be joined are stripped and the bared conductors of the wires assembled in a desired configuration to form a joint. The joint is placed in a transparent mold and the mold is filled with a photosetting resin. Radiation of an appropriate wavelength is then passed through the mold to harden the resin.

REFERENCES:
patent: 3226463 (1965-12-01), Wallace
patent: 3607507 (1971-09-01), Enos
patent: 4358331 (1982-11-01), Schmidt et al.
patent: 4606870 (1986-08-01), McGregor
patent: 4664732 (1987-05-01), Campbell et al.

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