Method for forming copper film using chemical vapor deposition

Details Method for forming copper film using chemical vapor deposition Method for forming copper film using chemical vapor deposition

1998-07-21

2000-12-26

Meeks, Timothy

Coating processes

Coating by vapor, gas, or smoke

Metal coating

42725523, C23C 1618

Patent

active

061655554

ABSTRACT:
A chemical vapor deposition apparatus and a copper film formation method are disclosed. The chemical vapor deposition apparatus includes a process gas delivery unit including a first storing unit using a liquid deposition source, a delivery unit for transferring a liquid deposition source in the first storing unit to an evaporator, and an evaporator for vaporizing the liquid deposition source transferred from the delivery unit and supplying a process gas; and a reaction chamber for receiving the process gas from the process gas delivery unit and deposition a predetermined thin film on a wafer or substrate mounted therein.

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