Coating processes – Electrical product produced – Wire conductor
Reexamination Certificate
2005-09-12
2011-10-11
Chen, Bret (Department: 1715)
Coating processes
Electrical product produced
Wire conductor
C427S118000, C427S250000, C427S255310, C427S255360, C427S096600
Reexamination Certificate
active
08034403
ABSTRACT:
A method of forming a primary coat, which consists of a V- or Ti-containing film, formed on the surface of a subject on which holes or the like have been formed, according to the CVD technique, while using, for instance, a tetravalent amide-type vanadium-containing organometal compound as a raw gas and using, for instance, tertiary butyl hydrazine as a reducing gas, and a copper-containing film is then formed on the primary coat, according to the CVD technique, to thus fill the holes or the like with the copper-containing film and to thus form copper distributing wire, which is excellent in the hole-filling properties and excellent in the adhesion to a primary coat, this process can be applied to the field of copper distributing wires used in the semiconductor industries.
REFERENCES:
patent: 6424036 (2002-07-01), Okada
patent: 7291558 (2007-11-01), Geffken et al.
patent: 2003/0082301 (2003-05-01), Chen et al.
patent: 2005/0080282 (2005-04-01), Kadota et al.
patent: 2006/0105570 (2006-05-01), Hautala et al.
patent: 2009/0263965 (2009-10-01), Gordon et al.
patent: 8-222568 (1996-08-01), None
patent: 11-217673 (1999-08-01), None
patent: 2003-017437 (2003-01-01), None
patent: 2003-522827 (2003-07-01), None
patent: 2003-252823 (2003-09-01), None
patent: 2003-292495 (2003-10-01), None
patent: 03/038892 (2003-05-01), None
patent: WO 03/064437 (2003-08-01), None
Molares, Maria, et al., “Singl-Crystalline Copper Nanowires Produced by Electrochemical Deposition in Polymeric Ion Track Membranes”. Advanced Materials, 2001, 13, No. 1, Jan. 5.
Watanabe Mikio
Zama Hideaki
Arent & Fox LLP
Chen Bret
Ulvac Inc.
LandOfFree
Method for forming copper distributing wires does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming copper distributing wires, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming copper distributing wires will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4277703