Method for forming contact hole on semiconductor device

Details Method for forming contact hole on semiconductor device Method for forming contact hole on semiconductor device

2011-01-04

2011-01-04

Tran, Binh X (Department: 1713)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

C438S717000, C438S736000

Reexamination Certificate

active

07862735

ABSTRACT:
A method of forming a relatively fine contact hole using two masks. The two masks may have only their edge portions open, which may overlap each other.

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Mack, Chris A. Field Guide to Optical Lithography. SPIE- International Society for Optical Engineering. Washingon, 2006, p. 38.

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