Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1998-07-09
2000-09-12
Utech, Benjamin L.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
156151, 216 18, 29846, C25D 502
Patent
active
061173002
ABSTRACT:
A method of forming circuit lines on a substrate by applying a roughened conductive metal layer using a copper foil carrier. The copper foil is etched away, leaving the roughened conductive metal embedded in the surface of the substrate. The conductive metal may be treated to remove an oxide layer. A photoresist may also be applied over the treated conductive metal layer to define a fine line circuit pattern. The photoresist defining the fine line circuit pattern is then removed to expose trenches in accordance with the desired circuit pattern. Copper is applied into the trenches over the exposed conductive metal, and the remaining photoresist, and conductive metal underlying the remaining photoresist, is removed to finish the fine line circuit pattern.
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Carbin Derek
Herrick Wendy A.
Brueske Curtis B.
Champagne Donald L.
Honeywell International , Inc.
Utech Benjamin L.
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