Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-03-25
2008-03-25
Cao, Phat Xuan (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S042000, C257SE21499
Reexamination Certificate
active
11604274
ABSTRACT:
The present invention provides to a substrate for a semiconductor device, in which electric characteristics to high-speed signals are enhanced by facilitating the mounting of a circuit component, such as a decoupling capacitor, fabricated separately from the substrate. The substrate for a semiconductor device, on which the circuit component, such as a decoupling capacitor, can be mounted, is counterbored from the mounting surface side thereof, and a component mounting hole where a connection terminal, which will be electrically connected to the circuit component, is exposed in the inner bottom face is made by counterboring. The circuit component is mounted and electrically connected to the connection terminal, and a semiconductor element is mounted on the substrate by flip-chip connection.
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Cao Phat Xuan
Kalam Abul
Nihon Micron Co., Ltd.
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