Method for forming chip carrier with a single protective encapsu

Details Method for forming chip carrier with a single protective encapsu Method for forming chip carrier with a single protective encapsu

1994-07-22

1995-11-28

Ledynh, Bot L.

Electric heating

Metal heating

For bonding with pressure

437211, 437902, 29841, 29855, B23K 100, H01L 2156

Patent

active

054710278

ABSTRACT:
The present invention relates generally to a new apparatus and method for a chip carrier. More particularly, the invention encompasses an apparatus and a method that uses a chip carrier having a single encapsulant to provide both flip chip fatigue life enhancement and environmental protection. A double-sided, pressure-sensitive, thermally-conductive adhesive tape could also be used with the encapsulated chip to directly attach the chip to a heat sink. Similarly, also disclosed is a method and apparatus for directly joining a heat sink to the chip carrier.

REFERENCES:
patent: 4069498 (1978-01-01), Joshi
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4908696 (1990-03-01), Ishihara et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5244142 (1993-09-01), Nishiguchi et al.
Research Disclosure, No. 270, Publication No. 27014, (Oct. 1986), entitled "Stick-On Heat Sink".

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