Method for forming ceramic thick film element arrays

Details Method for forming ceramic thick film element arrays Method for forming ceramic thick film element arrays

2006-07-04

2006-07-04

Fiorilla, Chris (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S289000, C156S247000, C156S235000, C156S155000, C156S241000, C156S230000, C156S080000

Reexamination Certificate

active

07070669

ABSTRACT:
An improved process for producing ceramic thick film array elements is provided. In this regard, ceramic elements are formed on a temporary, or printing, substrate by screen printing or other forming methods. The temporary, or printing, substrate is advantageously provided with a release layer. This makes it possible to release the printed and soft-baked ceramic elements from the temporary substrate and transfer the ceramic elements to the sintering substrate. The contemplated release technique takes advantage of the phase transition of a liquid, e.g. water, to transfer the elements to a sintering substrate. After sintering and electrode deposition, the ceramic element array is bonded to a target substrate. Then, the sintering substrate is removed to make the array available for implementation in a variety of suitable environments.

REFERENCES:
patent: 4345967 (1982-08-01), Cook
patent: 5480503 (1996-01-01), Casey et al.
patent: 6051448 (2000-04-01), Hayama et al.
patent: 6071795 (2000-06-01), Cheung et al.
patent: 6335263 (2002-01-01), Cheung et al.
patent: 6911107 (2005-06-01), Kagawa et al.

Affiliated with

Also associated with

Rating

Method for forming ceramic thick film element arrays does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming ceramic thick film element arrays, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming ceramic thick film element arrays will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3599645