Method for forming capacitor of semiconductor device

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Reexamination Certificate

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C438S253000, C438S785000, C257S306000, C257SE21647

Reexamination Certificate

active

07608517

ABSTRACT:
Disclosed is a method for forming a capacitor of a semiconductor device, which can secure wanted charging capacity and also improve leakage current characteristics. The method comprises the steps of: forming a storage electrode on a semiconductor substrate; forming a dielectric layer formed of Ti(1-x)TbxO on the storage electrode; and forming a plate electrode on the dielectric layer formed of Ti(1-x)TbxO.

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patent: 6790791 (2004-09-01), Ahn et al.
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patent: 2004/0009679 (2004-01-01), Yeo et al.
patent: 2004/0043541 (2004-03-01), Ahn et al.
patent: 2005/0130326 (2005-06-01), Lee et al.
patent: 1192985 (2002-04-01), None

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