Method for forming bumps using dummy wafer

Details Method for forming bumps using dummy wafer Method for forming bumps using dummy wafer

1999-01-27

2000-05-02

Picardat, Kevin M.

Chemistry: analytical and immunological testing

Optical result

With reagent in absorbent or bibulous substrate

438612, 438613, 438614, H01L 2144

Patent

active

060571683

ABSTRACT:
A method for forming bumps including the steps of forming bumps on a dummy wafer. The dummy wafer is diced into dummy chips and the bumps formed on the dummy chips are inspected. Thus only good bumps are transferred to a real chip on which circuit patterns are formed.

REFERENCES:
patent: 5219117 (1993-06-01), Lin
patent: 5607099 (1997-03-01), Yeh et al.
patent: 5646068 (1997-07-01), Wilson et al.
patent: 5860585 (1999-01-01), Rutledge et al.
"Replacement of Missing Solder Balls by Transient Wetting Transfer", IBM Technical Disclosure Bulletin, vol. 39, No. 7, Jul. 1, 1996, pp. 281-282.

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