Method for forming bump, semiconductor element having bumps...

Details Method for forming bump, semiconductor element having bumps... Method for forming bump, semiconductor element having bumps...

2007-02-13

2007-02-13

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S780000, C257S784000, C257S786000

Reexamination Certificate

active

11191976

ABSTRACT:
A tip of a wire formed in the shape of a ball is bonded to an electrode by using a tool. A part of the wire is drawn from the tip bonded to the electrode. A bump is formed on the electrode by deforming a portion of the wire continuous with the tip on the tip by using the tool. The wire is cut while leaving the bump on the electrode.

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