Method for forming bump protective collars on a bumped wafer

Details Method for forming bump protective collars on a bumped wafer Method for forming bump protective collars on a bumped wafer

2006-10-31

2006-10-31

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S613000, C257SE27161

Reexamination Certificate

active

07129111

ABSTRACT:
A method of forming bump protective collars is disclosed. A wafer has an active surface with a plurality of bonding pads and a passivation layer. A plurality of reflowed bumps are formed over the bonding pads. A photoresist is coated on the active surface. Using the reflowed bumps as a photo mask, the photoresist is exposed and developed. After removing the photoresist, a plurality of bump protective collars are formed on the passivation layer and around the reflowed bumps for improving the reliability of the reflowed bumps.

REFERENCES:
patent: 5872051 (1999-02-01), Fallon et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6187615 (2001-02-01), Kim et al.
patent: 6521530 (2003-02-01), Peters et al.

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