Method for forming bump on semiconductor elements

Details Method for forming bump on semiconductor elements Method for forming bump on semiconductor elements

1990-04-16

1991-10-22

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

228179, 228904, H01L 21607

Patent

active

050587986

ABSTRACT:
Method of forming bumps out of wire on the electrode of a semiconductor element is executed by setting a tip end underneath a vertically movable wedge, lowering the wedge to press the tip end of the wire against the semiconductor element, securely connecting the tip end to the electrode, and then pulling the wire away from the electrode to cut the wire, leaving the tip end on the electrode.

REFERENCES:
patent: 3531852 (1970-10-01), Slemmons et al.
patent: 3689983 (1972-09-01), Eltzroth et al.
patent: 3734386 (1973-05-01), Hazel
patent: 4750666 (1988-06-01), Neugebauer et al.
patent: 4771930 (1988-09-01), Gillotti et al.
IBM Technical Disclosure Bulletin, "Wire Bumping of Metal Surface", vol. 30, No. 7, p. 212, Dec. 1987.

Affiliated with

Also associated with

Rating

Method for forming bump on semiconductor elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming bump on semiconductor elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming bump on semiconductor elements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-103506