Method for forming bump electrode

Details Method for forming bump electrode Method for forming bump electrode

1994-11-16

1996-05-14

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228254, 228 14, 228 563, 427123, B23K 100, B23K 300

Patent

active

055160328

ABSTRACT:
The invention relates to a method for forming bump electrodes on an electronic part such as a chip or a substrate. Conventional methods for forming bump electrode had a factor causing high cost, but with the invention, instead of solder balls, low cost solder wires are used, that is, solder wires are cut in a predetermined length, the cut solder wires are vacuum-attracted to the lower face of a pick up head and transferred onto a chip, then the solder pieces transferred are heated to melt, then cooled to solidify and results in forming bump electrodes of hemisphere shape.

REFERENCES:
patent: 4944446 (1990-07-01), Thompson
IBM Technical Disclosure Bulletin, "Bench Brazer", vol. 30, No. 10, pp. 280-282, Mar. 1988.

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