Method for forming bulk resonators silicon <110>...

Metal working – Piezoelectric device making

Reexamination Certificate

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Details

C029S594000, C029S830000, C029S831000, C029S835000, C029S846000, C029S847000, C310S311000

Reexamination Certificate

active

07152289

ABSTRACT:
A method for forming a device on a substrate of <110> silicon includes forming a first conductive layer onto the substrate, and forming a piezoelectric layer on the first portion of a first conductive layer. A second electrode is formed on the piezoelectric layer, and a backside portion of the substrate under the piezoelectric layer and the first conductive layer is removed using a crystal orientated dependent etch.

REFERENCES:
patent: 4348609 (1982-09-01), Inoue
patent: 4443293 (1984-04-01), Mallon et al.
patent: 5067985 (1991-11-01), Carver et al.
patent: 5075641 (1991-12-01), Weber et al.
patent: 5129132 (1992-07-01), Zdeblick et al.
patent: 5185589 (1993-02-01), Krishnaswamy et al.
patent: 5485038 (1996-01-01), Licari et al.
patent: 5488504 (1996-01-01), Worchesky et al.
patent: 5714917 (1998-02-01), Ella
patent: 5883012 (1999-03-01), Chiou et al.
patent: 5910756 (1999-06-01), Ella
patent: 6109738 (2000-08-01), Miyata et al.
patent: 6131256 (2000-10-01), Dydyk et al.
patent: 6143976 (2000-11-01), Endros
patent: 288032 (1991-03-01), None
patent: 1073198 (2001-01-01), None
patent: 1306973 (2003-05-01), None
Barycka, Irena, et al., “Silicon anisotropic etching in KOH-isopropanol etchant”,Sensors and Actuators A, 48, Elseveier Science S.A., (1995), 229-238.
Krishnaswamy, S. V., et al., “Film Bulk Acoustic Wave Resonator and Filter Technology”,1992 IEEE MTT-S Digest, (Jun. 1-5, 1995), 153-155.
Lang, W., “Silicon Microstructuring Technology”,Materials Science and Engineering, R17, (1996), 1-55.
Ruby, Rich, “Micromachined Cellular Filters”,IEEE MTT-S Digest, (1996), 1149-4452.
Stoller, A. I., “The Etching of Deep Vertical-Walled Patterns In Silicon”,RCA Review, (Jun. 1970), 271-275.

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