Method for forming artificially and rapidly patina on copper, pr

Metal treatment – Process of modifying or maintaining internal physical... – Processes of coating utilizing a reactive composition which...

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148290, C23C 2200

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active

051603810

ABSTRACT:
A method for artificially forming patina on copper comprising: a) removing any impurity present on the surface of copper substrate; b) polishing the copper substrate with an aqueous solution containing sodium ions, copper ions, acetate ions, chlorine ions, sulphate ions, H+ ions and OH- ions until a brown color is obtained; c) washing the polished copper substrate having brown color of step (b), with water and drying; d) gently brushing the copper substrate having been dried according to step (c), washing and thoroughly drying; e) submitting the copper substrate after having been thoroughly dried according to step (d), to a filtered aqueous solution containing copper carbonate, ammonium chloride, copper acetate, arsenic trioxide, copper nitrate and hydrochloric acid until the desired patinated copper substrate is obtained. The invention covers also the products resulting from the method, as well as specific solutions to carry steps (b) and (e).

REFERENCES:
patent: 1951304 (1934-04-01), Freeman et al.
patent: 2587216 (1952-09-01), Quadrio
patent: 3152927 (1964-02-01), Mattsson et al.
patent: 3434890 (1969-06-01), Aronberg
patent: 3473970 (1969-11-01), Robey
patent: 3497401 (1970-09-01), Hanson et al.
patent: 3725138 (1973-07-01), Jones
patent: 4416940 (1983-03-01), Loye et al.
Colouring Copper, Metal Industry Jan. 19, 1951.

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