Abrading – Abrading process – Utilizing shield
Reexamination Certificate
2007-05-29
2007-05-29
Eley, Timothy V. (Department: 3724)
Abrading
Abrading process
Utilizing shield
C451S036000, C451S041000
Reexamination Certificate
active
11413993
ABSTRACT:
Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to a solvent to remove material from one of the first or second portions of the planarizing pad material at a faster rate than removing material from the other of the first and second portions. The process forms a plurality of recesses directly in the surface of the planarizing pad which are configured to support a planarizing liquid proximate to the surface of the planarizing pad material during planarization of the microelectronic substrate. Alternatively, the process can form a mold having protrusions that are pressed into the planarizing pad to define the recesses in the pad.
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Joslyn Michael J.
Kramer Stephen J.
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