Metal fusion bonding – Process – Diffusion type
Patent
1992-12-14
1993-09-07
Ramsey, Kenneth J.
Metal fusion bonding
Process
Diffusion type
72364, 228265, 2282351, 22826272, B23K 2002, B23K 2014
Patent
active
052421023
ABSTRACT:
A method of forming metallic structures that consists of immersing shaping dies with a blank workpiece sandwiched between them in a molten metal or alloy bath at a temperature within the superplastic temperature range of the workpiece. The pressure necessary for forming the workpiece is then applied by using weights or other means disposed over the dies. The workpiece is allowed to be formed by the gravitational force of the weights while it is maintained in a superplastic state. A metal or alloy that is free of harmful elements and contaminants that cause damage to the physical properties of the workpiece and that has a melting point below the superplasticity range of the workpiece is suitable for the molten bath. The molten metal serves the dual purpose of displacing all contaminants from the surface of the workpiece and of providing a conductive source of heat for raising the temperature of the workpiece to its superplastic range. Because of the contamination-free environment, very high working temperatures are permitted by this process and, correspondingly, relatively low loading pressures are required to achieve the desired deformation; thus, if necessary, relatively long process times are available for producing exact and intricate configurations that cannot otherwise be successfully obtained.
REFERENCES:
patent: 2903785 (1959-09-01), Hanink et al.
patent: 3574924 (1971-04-01), Dibble
patent: 3815219 (1974-06-01), Wilson
patent: 3920175 (1975-11-01), Hamilton et al.
patent: 3927817 (1975-12-01), Hamilton et al.
patent: 4013210 (1977-03-01), Deminet
patent: 4141483 (1979-02-01), Untilov et al.
patent: 5119535 (1992-06-01), Gnagy et al.
Durando Antonio R.
Ramsey Kenneth J.
Weiss Harry M.
LandOfFree
Method for forming and diffusion bonding titanium alloys in a co does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming and diffusion bonding titanium alloys in a co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming and diffusion bonding titanium alloys in a co will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-481920