Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-08-16
2011-08-16
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C257S098000, C257S687000, C257SE21499
Reexamination Certificate
active
07998765
ABSTRACT:
A method for manufacturing an LED lens structure includes the following steps of disposing a lead frame with the LED chip into a mold, and injecting thermoplastic transparent material to a plane of the lead frame which is different from a plane that LED chip is mounted thereon to form a lens structure corresponding to the LED chip.
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Chen Yuan-Fu
Liang Chih-Lung
Bradford Peter
Kile Goekjian Reed & McManus PLLC
Lite-On Technology Corp.
Richards N Drew
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