Method for forming an LED lens structure and related structure

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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C257S098000, C257S687000, C257SE21499

Reexamination Certificate

active

07998765

ABSTRACT:
A method for manufacturing an LED lens structure includes the following steps of disposing a lead frame with the LED chip into a mold, and injecting thermoplastic transparent material to a plane of the lead frame which is different from a plane that LED chip is mounted thereon to form a lens structure corresponding to the LED chip.

REFERENCES:
patent: 7268368 (2007-09-01), Knapp
patent: 2006/0157828 (2006-07-01), Sorg
patent: 2007/0121326 (2007-05-01), Nall et al.
patent: 2008/0044934 (2008-02-01), Loh et al.
patent: 2008/0253104 (2008-10-01), Inui
patent: 2009/0087931 (2009-04-01), Lee et al.
patent: 2009/0136179 (2009-05-01), Kim et al.

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