Method for forming an LED device with a metallic substrate

Details Method for forming an LED device with a metallic substrate Method for forming an LED device with a metallic substrate

2005-04-26

2005-04-26

Everhart, Caridad (Department: 2825)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S028000, C438S033000

Reexamination Certificate

active

06884646

ABSTRACT:
An LED epitaxial structure and a first electrode layer are formed on a provisional substrate in sequence. Then, a metallic permanent substrate is formed on the first electrode layer, and the provisional substrate is removed to expose a surface of the LED epitaxial structure. A plurality of second electrodes is formed on the surface of the LED epitaxial structure. Finally, the metallic permanent substrate, the first electrode layer, and the LED epitaxial structure are diced to form a plurality of LED devices.

REFERENCES:
patent: 20030189212 (2003-10-01), Yoo
patent: 20040077114 (2004-04-01), Coman et al.
patent: 20040079951 (2004-04-01), Horng et al.

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