Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate
2008-05-13
2008-05-13
Smith, Bradley K (Department: 2891)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
C438S424000, C257SE21546
Reexamination Certificate
active
07371657
ABSTRACT:
The present invention relates to a method of forming an isolating trench of a semiconductor device with a dielectric material, and to a method of forming an isolating trench in a memory device.
REFERENCES:
patent: 6669799 (2003-12-01), Putnam et al.
patent: 6864151 (2005-03-01), Yan et al.
patent: 6869860 (2005-03-01), Belyansky et al.
patent: 7291533 (2007-11-01), von Schwerin
patent: 2005/0159520 (2005-07-01), Lamb et al.
Heidemeyer Henry
Regul Joern
Wellhausen Uwe
Infineon - Technologies AG
Patterson & Sheridan L.L.P.
Smith Bradley K
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