Method for forming an etched recess package on package system

Details Method for forming an etched recess package on package system Method for forming an etched recess package on package system

2011-04-26

2011-04-26

Smith, Zandra V. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S123000, C438S172000, C438S191000, C438S235000, C257S677000, C257SE23053, C257SE21510

Reexamination Certificate

active

07932130

ABSTRACT:
An integrated circuit package system includes: providing a die attach paddle with interconnection pads connected to a bottom surface of the die attach paddle; connecting a first device to the interconnection pads with a bond wire; connecting a lead to the interconnection pad or to the first device; encapsulating the first device and the die attach paddle with an encapsulation having a top surface; and etching the die attach paddle leaving a recess in the top surface of the encapsulation.

REFERENCES:
patent: 5830800 (1998-11-01), Lin
patent: 6306682 (2001-10-01), Huang et al.
patent: 6710430 (2004-03-01), Minamio et al.
patent: 6972372 (2005-12-01), Tsai et al.
patent: 6974776 (2005-12-01), Dean et al.
patent: 7517733 (2009-04-01), Camacho et al.
patent: 2006/0261453 (2006-11-01), Lee et al.
patent: 2007/0181990 (2007-08-01), Huang et al.
patent: 2007/0187826 (2007-08-01), Shim et al.
patent: 2007/0209834 (2007-09-01), Kuan et al.
patent: 2007/0210443 (2007-09-01), Merilo et al.
patent: 2007/0252284 (2007-11-01), Su et al.
patent: 2007/0284715 (2007-12-01), Li et al.
patent: 2009/0072366 (2009-03-01), Badakere Govindaiah et al.

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