Method for forming an electrical connection to a semiconductor d

Details Method for forming an electrical connection to a semiconductor d Method for forming an electrical connection to a semiconductor d

1996-02-09

1997-09-09

Picardat, Kevin

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

438106, 2281805, H01L 2160

Patent

active

056656548

ABSTRACT:
A method for forming an electrical connection between a semiconductor die and a corresponding electrical component mounted within an electrical device is provided. The method includes wire bonding metal wires to the bond pads of the die and then severing the metal wires to form loose leads attached to the bond pads. With the die mounted to the electrical device, the loose leads are bonded to the electrical component using a bonding tip. In an illustrative embodiment, the electrical device is a field emission display package and the electrical component is conductive traces for the package. Advantageous, the method can be used to form the electrical connection between the die mounted in a sealed space and the corresponding electrical component which is outside of the sealed space.

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