Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
1999-08-02
2001-10-30
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S602100, C029S846000, C336S200000
Reexamination Certificate
active
06308406
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention was also described in a paper dated Dec. 1, 1997, that was submitted by the inventors and accepted into the Disclosure Document program as Disclosure Document No. 434368 on Apr. 7, 1998.
FIELD OF THE INVENTION
With regard to the classification of art, this invention is believed to be found in the general class entitled Electrical Conductors and Insulation and more particularly to those subclasses pertaining to methods for forming an electrical conductive pattern on a carrier material. The electrical conductive patterns are used in electrical circuit boards, low profile heater elements, and connecting means for electronic devices.
DESCRIPTION OF RELATED ART
The art of forming a conductive pattern on a substrate and the resulting products are well known. Traditionally the conductive pattern is formed on a copper clad substrate by employing a subtractive process, such as etching, machining and the like; or an additive process such as printing and the like. It has been found that there is a need to produce circuit patterns that are precise while minimizing the gaps between the circuit paths. The minimizing of the gaps between the circuit paths and the problems associated therewith have been identified in U.S. Pat. No. 5,493,074 that issued to Murata et al on Feb. 20, 1996. Murata teaches the use of a subtractive process such as etching for producing the conductive pattern then subsequently filling the gaps between the circuits with a cured product. However this process is slow, capital intensive, and involves the use of chemicals that may be hazardous to the environment. The known subtractive and/or additive processes mentioned above do not provide the electrical conductive pattern that has the precision and repeatability that is needed for certain applications. The lack of precision and repeatability results in variations of conductor values such as conductance, resistance and the like.
SUMMARY OF THE INVENTION
The present invention solves the above identified needs by precisely separating the conductive electrical paths by mechanical means. The instant invention does not require the use of hazardous chemicals. The present invention therefore provides a method that is economical by increasing productivity while minimizing the cost for the disposal of waste. The present invention lends itself to automatic production machinery.
The present invention may be briefly summarized with respect to its objects. It is an object of this invention to provide and it does provide a method for producing an electrical conductive pattern on a substrate that results in a precisely formed conductive circuit while simultaneously maintaining the separation of the conductive paths.
It is a further object of this invention to provide and it does provide a method for producing an electrical conductive pattern on a flexible substrate that is arrayed for attachment to a support means.
It is another object of this invention to provide and it does provide a method for producing an electrical conductive pattern on a substrate that results in an induction heater that has a low profile and provides a routing of a current through a conductive pathway that produces heat when a selected electrical current is applied. This method provides a precisely sized conductive pathway that is consistently reproducible.
It is still another object of this invention to provide and it does provide a method for producing a precise electrical conductive pattern on a flexible substrate that results in an induction heater that has a low profile and is arrayed for attachment to an article that is to be heated
One embodiment of the method of the present invention may be briefly described as a method for producing an electrical conductive pattern on a substrate including the steps of:
a) providing a substrate layer, the substrate layer being non conductive and having a predetermined thickness;
b) bonding a layer of a conductive material to one face of the substrate layer by means of heat and pressure to activate a first bonding means, the first bonding means having a predetermined melting temperature, the one face of the substrate layer being cleaned and prepared by a treating means prior to the application of the bonding means;
c) bonding a cover layer to an exposed surface of the conductive material by means of heat and pressure to activate a second bonding means, the cover layer having a predetermined thickness and fully covering the exposed surface of the conductive material, the second bonding means having a predetermined melting temperature;
d) forming at least one path for an electrical circuit in the conductive material by severing the conductive material by and with a blade, the blade including a predetermined cutting edge configuration, the blade being further arrayed for providing a predetermined cutting pattern, the blade may also include a temperature control means for maintaining the blade within a predetermined temperature range; the cutting edge configuration of the blade being arrayed for severing the cover layer and penetrating a selected distance into the substrate layer during the severing of the conductive material, the blade simultaneously shaping and setting selected portions of the top layer, the second bonding means, the conductive material, and the first bonding means so that at least one continuous predetermined gap is provided between severed portions of the conductive layer;
e) subsequently applying an insulating coating completely over an exposed surface of the severed top layer so that the insulating coating also fills all of the predetermined gaps;
f) allowing the insulating coating to set so that the insulating coating maintains the predetermined gap as and when the flow of current passes through the at least one path;
g) applying, attaching, and connecting electrical connection terminals into selected positions along the at least one path;
h) selectively applying a pressure sensitive strip to an exposed surface of the insulating surface;
i) selectively applying a pressure sensitive strip to a second face of the substrate; and
j) dividing the substrate and the circuits carried thereon into discreet units.
In addition to the above summary, the following disclosure is intended to be detailed to insure adequacy and aid in the understanding of the invention. However, this disclosure, showing particular embodiments of the invention, is not intended to describe each new inventive concept that may arise. These specific embodiments have been chosen to show at least one preferred or best mode of the present invention as presently known. These specific embodiments, as shown in the accompanying drawings, may also include diagrammatic symbols for the purpose of illustration and understanding.
REFERENCES:
patent: 3445921 (1969-05-01), Leenhouts
patent: 4970495 (1990-11-01), Matsumoto et al.
patent: 5263248 (1993-11-01), Kiyota et al.
patent: 5950305 (1999-09-01), Roberts
patent: 6032357 (2000-03-01), Wojewnik
patent: 6087940 (2000-07-01), Caperna et al.
patent: 6161276 (2000-12-01), Droz
patent: 6176010 (2001-01-01), Droz
Gill Peter L.
Ramsey Joseph W.
Arbes Carl J.
Pinto Patrick J.
Thermotrax Corporation
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