Method for forming alloy layer upon aluminum alloy substrate by

Coating processes – Electrical product produced – Welding electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

219 761, 219121LC, 219121LD, 219121LF, B05D 306

Patent

active

047465409

ABSTRACT:
In this method for forming an alloy layer on the surface of an aluminum alloy substrate, a powder for alloying, containing a substance to be alloyed with the substrate and an element selected from the group consisting of silicon and bismuth, is disposed upon the surface of the aluminum alloy substrate. This powder is then irradiated with a CO.sub.2 laser, so as to be melted and fused together with a surface portion of the aluminum alloy substrate, so that these two are alloyed together. The powder for alloying may be a powder of an alloy of the substance to be alloyed with the aluminum alloy substrate and the element selected from the group consisting of silicon and bismuth, or alternatively may be a mixture of a powder of the substance to be alloyed with the aluminum alloy substrate and a powder of the element selected from the group consisting of silicon and bismuth.

REFERENCES:
patent: 4125926 (1978-11-01), Gale
patent: 4157923 (1979-06-01), Yen et al.
patent: 4212900 (1980-07-01), Serlin
patent: 4382169 (1983-05-01), Rabkin
patent: 4401726 (1983-08-01), Gnanamuthu
patent: 4451302 (1984-05-01), Prescott et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming alloy layer upon aluminum alloy substrate by does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming alloy layer upon aluminum alloy substrate by , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming alloy layer upon aluminum alloy substrate by will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1057640

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.