Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2007-05-08
2007-05-08
Lee, Hsien-Ming (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S021000, C438S032000, C438S149000
Reexamination Certificate
active
11195903
ABSTRACT:
Disclosed is a method for forming an alignment layer of an LCD capable of preventing Mura defects when the alignment layer is formed through an LC one drop fill process. The method includes the steps of coating a mixing solution including a solvent and organic polymer materials consisting of polyimide and polyamic acid on the substrates, pre-curing the mixing solution twice with mutually different temperatures, thereby volatizing the solvent and obtaining stable phase-separation between the organic polymer materials and the solvent, and completely curing the pre-cured mixing solution at a temperature of about 180 to 240° C. A primary pre-curing process is performed at a temperature less than 50° C. under vacuum pressure of about −35 to −50 psi, and a secondary pre-curing process is performed at a temperature within a range of about 50 to 75° C. under the same vacuum pressure.
REFERENCES:
patent: 2005/0260426 (2005-11-01), Kwok et al.
patent: 2006/0035038 (2006-02-01), Lee et al.
patent: 10-1999-0075414 (1999-10-01), None
patent: 10-2004-0110833 (2004-12-01), None
Choi Soo Young
Park Young Il
Son Gon
Suh Dong Hae
Boe Hydis Technology Co., Ltd.
Keefer Timothy J.
Lee Hsien-Ming
Seyfarth Shaw LLP
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