Method for forming a thin uniform layer of resist for lithograph

Details Method for forming a thin uniform layer of resist for lithograph Method for forming a thin uniform layer of resist for lithograph

1997-03-04

1998-12-15

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Use of sound or nondigital compressive force

430313, 430327, 430330, G03F 716, G03F 726

Patent

active

058494359

ABSTRACT:
A method for forming a layer of resist on a non-planar substrate includes the steps of: dispensing resist onto the substrate; spinning the substrate to spread the resist; and then vibrating the substrate to eliminate voids in the resist. Optionally, the substrate can be inverted and vibrated at the same time to distribute the resist over the sidewalls of any projections or plateaus on the non-planar substrate. Following the vibrating and optional inversion steps, the resist is partially hardened, an edge bead is removed and a backside of the resist is washed. These steps are followed by soft bake, exposure and development of the layer of resist.

REFERENCES:
patent: 4239790 (1980-12-01), Bosenberg
patent: 4633804 (1987-01-01), Arii
patent: 5202222 (1993-04-01), Harris
patent: 5227001 (1993-07-01), Tamaki
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5354705 (1994-10-01), Mathews et al.
patent: 5366757 (1994-11-01), Lin
patent: 5408190 (1995-04-01), Wood et al.
patent: 5480524 (1996-01-01), Oeste
patent: 5512154 (1996-04-01), Rischke
Wolf S. et al., Silicon Processing for the VLSI Era, vol. 1--Process Technology, pp. 430-426, Lattice Press, 1986.

Affiliated with

Also associated with

Rating

Method for forming a thin uniform layer of resist for lithograph does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a thin uniform layer of resist for lithograph, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a thin uniform layer of resist for lithograph will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1456096