Method for forming a thin film resistor structure

Semiconductor device manufacturing: process – Making passive device – Resistor

Reexamination Certificate

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C438S382000, C438S385000

Reexamination Certificate

active

07078306

ABSTRACT:
The present invention relates to a method for forming a thin film resistor and a thin film resistor formed over a semiconductor substrate. A gate structure is formed and a dielectric layer is formed over the gate structure. A via is then etched that extends through the dielectric layer so as to expose a portion of the gate structure. A layer of titanium nitride is deposited using a chemical vapor deposition process. A rapid thermal anneal is performed in an oxygen ambient. The rapid thermal anneal incorporates oxygen into the titanium nitride, forming titanium oxynitride film. A layer of dielectric material is then deposited and etched-back to form a dielectric plug that fills the remaining portion of the via. The titanium oxynitride film is patterned to form a titanium oxynitride structure that is electrically coupled to the gate structure. A metal layer is deposited and patterned to form an interconnect structure that electrically couples the titanium oxynitride structure to other circuitry.

REFERENCES:
patent: 5585301 (1996-12-01), Lee et al.
patent: 5710070 (1998-01-01), Chan
patent: 6127217 (2000-10-01), Madurawe et al.
patent: 6461929 (2002-10-01), Lobl et al.
patent: 6466124 (2002-10-01), Shibuya et al.

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