Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1998-06-09
2000-08-15
Beck, Shrive
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
427229, 427250, 427294, 20419212, H05H 100, B05D 302, C23C 1435
Patent
active
061033200
ABSTRACT:
A method for forming a thin film of a metal compound is disclosed. Within a vacuum chamber, a metallic ultra-thin film of a metal or an incompletely-reacted metal is deposited on a substrate. The metallic ultra-thin film is brought in contact with the electrically neutral activated species of a reactive gas so as to convert the metallic ultra-thin film to an ultra-thin film of a metal compound through the reaction of the metallic ultra-thin film with the activated species of the reactive gas. The above-described steps are sequentially repeated so as to deposit on the substrate the ultra-thin film of the metal compound in layers until a thin film of the metal compound having a desired thickness is formed on the substrate.
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Patent Abstracts of Japan, vol. 12, No. 358 (C-531), Sep. 26, 1988 & JP 63-114966, May 19, 1988.
J. Vac. Sci. Technol. A (15)(5), Sep./Oct. 1997, pp. 2670-2672, Tang, Ogura, Yamasaki, and Kikuchi.
Kikuchi Kazuo
Matsumoto Shigeharu
Beck Shrive
Chen Bret
Shincron Co., Ltd.
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