Method for forming a thin film

Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized

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438761, 438763, 438764, 4272552, 4273977, 427559, 427579, 427101, B05D 512, B05D 302, C23C 1600

Patent

active

058173684

ABSTRACT:
Alternate formation of high-resistance and low-resistance layers form a thin film with reduced dopant gradient in its thickness. A desired sheet resistance is attained by adjusting the thickness of the stacked layers, the degree of doping of the film, and the number of layers used to make the thin film during the film formation process.

REFERENCES:
patent: 3764411 (1973-10-01), Brown
patent: 4062034 (1977-12-01), Matsushita et al.
patent: 4176372 (1979-11-01), Matsushita et al.
patent: 4199384 (1980-04-01), Hsu
patent: 4260663 (1981-04-01), Hagemann et al.
patent: 4262299 (1981-04-01), Ham
patent: 4344985 (1982-08-01), Goodman et al.
patent: 4420765 (1983-12-01), Tarng
patent: 4433469 (1984-02-01), Goodman
patent: 4489103 (1984-12-01), Goodman et al.
patent: 4615908 (1986-10-01), Behn et al.
patent: 4990464 (1991-02-01), Baumgart et al.
patent: 5192714 (1993-03-01), Suguro et al.
patent: 5200635 (1993-04-01), Kaga et al.
patent: 5428244 (1995-06-01), Segawa et al.
patent: 5470779 (1995-11-01), Yoo
patent: 5470780 (1995-11-01), Shishiguchi
patent: 5532183 (1996-07-01), Sugawara et al.
patent: 5605859 (1997-02-01), Lee
patent: 5688724 (1997-11-01), Yoon et al.

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